561 Каталог KYOCERA 2017 Инструмент сборный и монолитный для станков Стр.K4

Каталог KYOCERA 2017 Инструмент режущий Стр. K4 0561 Lab2u

MagicDrill DRA K DRA DRC DRV DRS DRZ DRX DRW Fine Micro High Efficiency Modular Drill MagicDrill DRA Excellent hole accuracy with a low cutting force design 5 advantages to efficiently solve common drilling difficulties Low cutting force design improves hole accuracy Optimal web thickness limits deflection Special chisel edge with S-curve reduces thrust force and controls vibration Improved hole accuracy by controlling drill deflection with a 20% thicker web compared with Competitor A Cutting edge image DRA Web Thickness Comparison UP 20% Cutting force Cutting Conditions : Vc=120m/min, f=0.25mm/rev comparison Drill Dia. 14, Drilling Depth 45mm, Wet (Internal evaluation) Workpiece Material: S50C 4,000 3,000 2,000 1,000 Roundness Cylindricity Comparison (Internal evaluation) Cutting Conditions : Vc=120m/min, f=0.3mm/rev Drill Dia. 14, Measurement point 55mm, Wet Workpiece Material: S50C Competitor E Roundness 18.7 im 31.1 im 27.3 im : DRA Competitor B Competitor C Cylindricity 23%m 34.3 im 30.1 im 0 Fine chip breaking even in deep hole drilling applications Optimized chip thinning for stable chip evacuation Support groove with wider flute (5D, 8D) enables smooth chip evacuation Chip Cutting Conditions:Vc=60m/min, f=0.2mm/rev, Drill Dia. 14 Comparison Drilling Depth 70mm, Wet Workpiece Material:SUS304 (Internal evaluation) (First Chip) DRA Competitor F Competitor G Support groove (Assist chip evacuation) K4